Proteus 8.3 SP2 with Advanced Simulation
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<br> Proteus 8.3 was largely based around re-working the way in which we transition from PCB Layout (ECAD) through to mechanical layout (MCAD). Over the last few years the STEP file format has become the de-facto standard for data exchange and we have therefore implemented full support in the Version 8.3 release.
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<br> We have also taken a close look at our customer feedback logs and implemented several of the most requested features. Main highlights of this release include:
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<br>Support for MCAD data exchange via STEP and IGES file formats. Both import of component STEP/IGES files and export of the resulting STEP Assembly is supported (requires L2 or higher
<br>Extensive modifications to existing libraries to include pre-supplied STEP files for radial electrolytics, connectors and some other common parts
<br>Support for multiple track editing operations and enhancements to track necking
<br>Enhanced support for design re-use via sub-circuit binding on the Replicate command
<br>Enhancement of print sets in ARES to allow paste and soldermask prints alongside copper layers
<br>Addition of single layer options for keepout objects (ctx menu command on the keepout object
<br>Significant rework of the PDF output to address various issues with the existing implementation. Also added SVG output
<br>Addition of MSP430G2x variant set
<br>Addition of PIC18F45K50 variant set
<br>Addition of ILI9341 TFT LCD (SPI Mode Only) and associated Arduino Shield
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<br> Proteus 8.3 was largely based around re-working the way in which we transition from PCB Layout (ECAD) through to mechanical layout (MCAD). Over the last few years the STEP file format has become the de-facto standard for data exchange and we have therefore implemented full support in the Version 8.3 release.
<br>
<br> We have also taken a close look at our customer feedback logs and implemented several of the most requested features. Main highlights of this release include:
<br>
<br>Support for MCAD data exchange via STEP and IGES file formats. Both import of component STEP/IGES files and export of the resulting STEP Assembly is supported (requires L2 or higher
<br>Extensive modifications to existing libraries to include pre-supplied STEP files for radial electrolytics, connectors and some other common parts
<br>Support for multiple track editing operations and enhancements to track necking
<br>Enhanced support for design re-use via sub-circuit binding on the Replicate command
<br>Enhancement of print sets in ARES to allow paste and soldermask prints alongside copper layers
<br>Addition of single layer options for keepout objects (ctx menu command on the keepout object
<br>Significant rework of the PDF output to address various issues with the existing implementation. Also added SVG output
<br>Addition of MSP430G2x variant set
<br>Addition of PIC18F45K50 variant set
<br>Addition of ILI9341 TFT LCD (SPI Mode Only) and associated Arduino Shield
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